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Series,
a new, fast curing, flexible, highly damped epoxy for adhesive and
potting applications. Mereco 1670 Series has been specifically designed
for customer applications where a quick curing adhesive or potting
material is required. Mereco 1670 Series provides excellent protection
of electronic components, ranging from transducers, sensors, load
cells, delicate magnetic coils, and bobbins to power supply applications
where no inductance drop after potting or bonding is desired.
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Cures
in 10 minutes at room temperature (20 gram mix)
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Good
coefficient of thermal expansion, 60 100 ppm
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Excellent
bonding, tensile lap shear strength of 1,000 psi (Al to Al)
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Protects
components from internal stresses
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Low
cost alternative to silicone RTV
For more information contact us Mereco Technologies, 1-800-556-7164 or e-mail requests to info@mereco.com.
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