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For Immediate Release, September 15, 2004 MERECO TECHNOLOGIES INTRODUCES NEW THERMALLY
CONDUCTIVE SILICONE RTV FOR HEAT TRANSFER APPLICATIONS
September 15, 2004
Mereco Technologies Group Companies, and its operating units
Metachem Resins Corporation (MERECO) and DMS, has developed a new,
thermally conductive silicone RTV,
Metasil™ 5060, specifically designed for heat transfer
applications in the electronics industry.
Mereco Metasil™ 5060 is ideal for transferring heat from hot devices
to heat sinks, PC boards, metal enclosures, backplanes, or chassis.
It is ideally suited for the potting and encapsulating of high
efficiency dc/dc converters and power supplies.
"Metasil™ 5060 is an efficient thermal connection from the device
surface to the initial heat sink and on to the ambient environment.
It combines the natural high temperature and flexible properties of
silicone with ease of cure and application." according to Philip M.
Papoojian, Mereco's President and COO.
Metasil™ 5060 is a 1:1 mix ratio RTV that cures at room temperature
in 24-48 hours and can be heat accelerated to cure in 2 hours at 65°
C. It is supplied in pint, quart, 2 quart and 2 gallon kits as well
as 50ml, 200ml, and 400ml dual cartridges.
Mereco Technologies Group Companies, founded in 1960, is a West
Warwick, RI based specialty chemical manufacturer and formulator of
polymer resins, epoxies, urethanes, silicones, electrically
conductive, and other advanced adhesives and coatings for
electronics, aerospace, and industrial applications. For more
information contact Mereco Technologies at (800) 556-7164 or e-mail
requests to info@mereco.com.
* Click here for MERECO METASIL 5060 Data Sheet. |
