For Immediate Release, September 15, 2004

MERECO TECHNOLOGIES INTRODUCES NEW THERMALLY CONDUCTIVE SILICONE RTV FOR HEAT TRANSFER APPLICATIONS

September 15, 2004

Mereco Technologies Group Companies, and its operating units Metachem Resins Corporation (MERECO) and DMS, has developed a new, thermally conductive silicone RTV, Metasil™ 5060, specifically designed for heat transfer applications in the electronics industry.

Mereco Metasil™ 5060 is ideal for transferring heat from hot devices to heat sinks, PC boards, metal enclosures, backplanes, or chassis. It is ideally suited for the potting and encapsulating of high efficiency dc/dc converters and power supplies.

"Metasil™ 5060 is an efficient thermal connection from the device surface to the initial heat sink and on to the ambient environment. It combines the natural high temperature and flexible properties of silicone with ease of cure and application." according to Philip M. Papoojian, Mereco's President and COO.

Metasil™ 5060 is a 1:1 mix ratio RTV that cures at room temperature in 24-48 hours and can be heat accelerated to cure in 2 hours at 65° C. It is supplied in pint, quart, 2 quart and 2 gallon kits as well as 50ml, 200ml, and 400ml dual cartridges.

Mereco Technologies Group Companies, founded in 1960, is a West Warwick, RI based specialty chemical manufacturer and formulator of polymer resins, epoxies, urethanes, silicones, electrically conductive, and other advanced adhesives and coatings for electronics, aerospace, and industrial applications. For more information contact Mereco Technologies at (800) 556-7164 or e-mail requests to info@mereco.com.

 

* Click here for MERECO METASIL 5060 Data Sheet.

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