Mereco Introduces Metaduct 1245 Fast Curing Electrically Conductive Epoxy Adhesive
Posted: Aug 15, 2012
MERECO Metaduct 1245 is a fast curing rapid bonding room temperature setting epoxy electrically conductive adhesive. After only 45 seconds MERECO MetaductTM 1245 provides tensile shear strengths in excess of 600 psi. This unique non-flammable one hundred percent solid adhesive has a 2:1 mix ratio by weight or by volume and sets to a highly electrically conductive bond.
"This new fast cure electrically conductive adhesive technology will allow our electronics customers to significantly advance their processing times and efficiencies, meeting the continual improvement goals of their quality programs." according to Philip M. Papoojian, President & COO.
MERECO Metaduct 1245 repairs printed circuits, fastens down and seals electronic components, can replace soft soldering and welding of jewelry which can be electrically plated. It is used for bonding electrical and electronic devices where soldering is not practical and electrical conductivity is a requirement.
Cold “soldering” of discrete components such as resistors, flat packs, antenna, hybrids and other miniaturized circuits.
Lead attachments for LED’s, potentiometers, filters, wave guides, crystals and other frequency controls.
Chip bonding and die attachment.
Adaptable for RF shielding and electrically conductive patterns.
Solderable conductive terminations for tantalum capacitors.
No solvent . . . 100% active
Non-bleeding . . . Useful from –55º to 175º C
Thixotropic . . . No Drip or sag
*Available as a non-electrical conducting adhesive
DIRECTIONS FOR USE
Bonding surfaces must be scrupulously clean! Alkaline substances (uncleaned aluminum or even aluminum oxide abrasives) can neutralize the activity of the adhesive. Detergent cleaning agents and other chemical cleaners must be washed off, and surface must be dry. Simple equal parts mixtures of base and activator may be used. However, for maximum bond strength a 2 to 1 mixture of MERECO MetaductTM 1245 Base to Activator is recommended. Approximately one ounce of material (30 grams) is the largest practical amount which can be easily mixed and applied due to the speed of reaction and exotherm of 250º F. Adding less Activator WILL NOT slow down the adhesive but will only reduce the bond strength.
TYPICAL PROPERTIES OF UNCURED MERECO METADUCT 1245 ADHESIVIVE
|Shelf Life||6 months||3 months|
TYPICAL BOND STRENGTHS VS SETTING TIME FOR CURED MERECO METADUCT 1245
Metal surfaces (2 to 4 mils glue line) using 1 part of Activator to 2 parts of Base.
TYPICAL CURED STATE PROPERTIES(1)
Tensile Strength, psi 3500
Lap Shear Strength, psi (avg.) 1100
Hardness (Shore D) 80
Specific Gravity (25º / 25º C) 2.7
Water Immersion (30 days 27º C)
Weight Gain, % 0.23
BTU.in/hr.ft 2.º F 98
CAL/sec.cm.º C .028
Weight loss 1000 hr at 175º C), % 0.4
Operating Range, ºC -55 to 175
Volume Resistivity (25º C), ohm.cm 0.001
MERECO MetaductTM 1245 is fully cured after seven days at room temperature. Faster cure and improved conductivity can be obtained with a one hour cure at 65ºC. The following table compares the conductivity of MERECO Metaduct 1245 with that of some familiar substances.
|Substance||ohm * cm||cal/sec * cm * °C|
|Silver||1 x 10-6||1.000|
|Nichrome||1 x 10-4||0.032|
|Mereco Metaduct 1245||1 x 10-3||0.028|
|Standard Epoxy||1 x 1015||0.0003|
|Aluminum Oxide||1 x 1015||0.084|
|Beryllium Oxide||1 x 1016||0.550|
Contact the Mereco Technical Support Department at 800-556-7164 ext. 134 or complete and submit the Applications Planner listed on this website.