Flexible Adhesives
Mereco flexible adhesives are formulated for maximum reactivity to eliminate the use of plasticizers which can volatilize or exude over time. Applications include shock and vibration, CTE mismatch, flexible circuits, BGA’s and MCM’s.
Flexible Epoxy Resin Systems
| Product Designation | Highlight Description | Mix Ratio B to A |
Mixed Viscosity, CPS | Working Time at 25°C |
Cure Schedules | Hardness Shore A or D |
Conductivity OHM* CM or BTU |
MSDS | PDB |
|---|---|---|---|---|---|---|---|---|---|
| Mereco XLN-589 | Flexible, Low Slump, Thermally Conductive |
1:1 | 200,000 | 4 hours | 24 hours at 25°C 2 hours at 65°C |
85A | 3.2 BTU | Mereco XLN589 | Mereco XLN589 |
| Metaduct 1240 | Flexible Adhesive, Electrically Conductive |
One Part | 40,000 | 3 months | 15 minutes at 150°C | 45A | 0.0001 | Metaduct 1240 | Metaduct 1240 |
| Mereco CLN-658 | Flexible Adhesive, Electrically Conductive |
1:1 | Thixotropic | 2.5 hours | 24 hours at 25°C 2 hours at 65°C |
75A | 0.005 | Mereco CLN658 | Mereco CLN658 |