TWO COMPONENT SILICONE RTV SYSTEMS |
Product
Designation |
Highlight
Description |
Mix Ratio B to A |
Mixed Viscosity, CPS |
Working Time at 25ºC 100Gram |
Cure Schedule |
Hardness Shore A or D |
Volume Resitivity OHM * CM |
|
METASIL
5002 |
Hi-Temp Potting Encapsulating |
100:0.5 |
32,000 |
2 Hours |
24 Hours at 25ºC |
55A |
2.5 x 1015 |
|
METASIL
5023 |
Addition Cure Potting/Moldmaking |
10:1 |
12,000 |
2.5 Hours |
2 Hours at 65ºC 15 Min. at 150ºC |
30A |
1.0 x 1015 |
|
METASIL 5024T MOD 4 |
Thermally Conductive Addition Cure |
1:1 |
Thixotropic |
30 Minutes |
24 Hours at 25ºC 2 Hours at 65ºC |
50 +/-5A |
7.0 x 1014 |
|
METASIL 5060 |
Thermally Conductive For DC/DC
Converters |
1:1 |
Thixotropic |
30 Minutes |
24 Hoursat 25ºC 2 Hours at 65ºC |
50A |
7.0 x 1014 |
|
METASIL 5061 |
MaskingComound |
1:1 |
Thixotropic |
2.5 Hours |
24 Hours at 25ºC 2 Hours at 65ºC |
35 +/-5A |
7.0 x 1014 |
ONE COMPONENT SILICONE RTV SYSTEMS |
|
METASIL 5002 |
High Performance Adhesive |
Part |
Thixotropic |
6 Months |
24 Hours at 25ºC Tack-Free
-20 Min. |
30A |
1.5 x 1012 |
