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TWO COMPONENT
SILICONE RTV SYSTEMS
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Product
Designation
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Highlight
Description
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Mix
Ratio
B to A
|
Mixed Viscosity, CPS
|
Working Time
at 25ºC
100 Gram
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Cure Schedule
|
Hardness
Shore
A or D
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VOLUME
RESITIVITY
OHM * CM
|
METASIL
5022 |
HI-TEMP POTTING
ENCAPSULATING |
100:0.5 |
32,000 |
2 HOURS |
24 HOURS AT 25 oC |
55A |
2.5 x 1015 |
METASIL
5023 |
ADDITION CURE
POTTING/MOLDMAKING |
10:1 |
12,000 |
2.5 HOURS |
2 HOURS AT 65 oC
15 MIN. AT 150 oC |
30A |
1.0 x 1015 |
METASIL 5024T MOD 4 |
THERMALLY CONDUCTIVE
ADDITION CURE |
1:1 |
THIXOTROPIC |
30 MINUTES |
24 HOURS AT 25 Oc
2 HOURS AT 65 oC |
50 +/- 5 A |
7.0 x 1014 |
METASIL
5060 |
THERMALLY CONDUCTIVE
FOR DC/DC CONVERTERS |
1:1 |
THIXOTROPIC |
30 MINUTES |
24 HOURS AT 25 Oc
2 HOURS AT 65 oC |
50A |
7.0 x 1014 |
METASIL
5061 |
MASKING COMOUND |
1:1 |
THIXOTROPIC |
2.5 HOURS |
24 HOURS AT 25 Oc
2 HOURS AT 65 oC |
35 +/- 5 A |
7.0 x 1014 |
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ONE COMPONENT
SILICONE RTV SYSTEMS
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|
METASIL
5002
|
HIGH PERFORMANCE
ADHESIVE |
ONE
PART |
THIXOTROPIC |
6 MONTHS |
24 HOURS. AT 25 oC
TACK-FREE - 20 MIN. |
30A |
1.5 x 1012 |